Gigavis signed a ₩8.95bn contract for semiconductor substrate inspection and repair equipment. The order equals 17.08% of FY2025 consolidated revenue. An unnamed Japanese substrate manufacturer is the buyer. The contract runs from August 18, 2026 through September 30, 2027. Payments comprise 30% upfront, 60% intermediate and a 10% balance. The value and period may change.
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|---|---|
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